Development of a DSP/MCM Subsystem Assessing Low-volume, Low-cost MCM Prototyping for Universities

1 This work was sponsored in part by ARPA under grant DAAH04-94-G-0004 Abstract This paper discusses the design and development of a general-purpose programmable DSP subsystem packaged in a multichip module. The subsystem contains a 32-bit floating-point programmable DSP processor along with 256 K-byte of SRAM, 128 K-byte of FLASH memory, 10 K-gate FPGA and a 6-channel 12-bit ADC. The complete subsystem is interconnected on a 37 mm by 37 mm MCM-D substrate and packaged in a 320-pin ceramic quad flat pack. The design has been submitted to the MIDAS brokerage service to be fabricated by Micro Module Systems. Our experience shows that low-volume MCM prototyping is achievable and somewhat affordable for universities. The design flow, electrical and thermal analyses, CAD tools, cost and lessons learned are discussed in this paper.